Short Pulse Laser Processing Machine - メーカー・企業と製品の一覧 | イプロス

Short Pulse Laser Processing Machineの製品一覧

1~2 件を表示 / 全 2 件

表示件数

[Information] Dramatically Changing Tribological Properties through Ultrafast Pulse Laser Processing

How does tribology improve through ultrashort pulse laser processing and composite treatment?

This document introduces the advantages of ultra-short pulse laser processing, including application examples. It covers the mechanisms for reducing friction and wear through surface texture formation with ultra-short pulse lasers, as well as improvements in tribological characteristics through laser processing, 3D wrapping, and DLC composite treatments. Our company and our group company, Friction Co., Ltd., have introduced a picosecond laser system as a new technology to improve tribological characteristics. [Contents] ■ Mechanisms for reducing friction and wear through surface texture formation with ultra-short pulse lasers ■ Improvement of tribological characteristics through laser processing, 3D wrapping, and DLC composite treatments ■ Reduction of friction in valve lifters using ultra-short pulse lasers and 3D wrapping ■ Reduction of friction in piston rings using ultra-short pulse lasers ■ Reduction of friction in turbocharger bearings using ultra-short pulse lasers *For more details, please download the PDF or feel free to contact us.

  • others
  • Short Pulse Laser Processing Machine

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Short pulse laser processing machine [for drilling and cutting silicon wafers, etc.!]

A short-pulse laser processing machine used for drilling and cutting silicon wafers!

The "Short Pulse Laser Processing Machine" is a processing machine that is applied to drilling, cutting of silicon wafers, and laser patterning of thin-film solar cell materials due to its features such as high output and fine processing. Additionally, it is used for cutting and drilling of lithium battery metal films, substrate cutting, and sapphire cutting. 【Features】 ■ Output: 20W, Pulse Width: 100ps ■ Peak Power Output: 300kW ■ Frequency: Adjustable from 30kHz to 1000kHz ■ Pulse Energy: 300μJ@1ns ■ Beam Quality: M2 < 1.3 *For more details, please request materials or view the PDF data available for download.

  • others
  • Short Pulse Laser Processing Machine

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録